Interactions between dislocations and grain boundaries contribute significantly to plastic behaviour in polycrystalline metals. But a full understanding of the processes and of their influence on plastic response has yet to be achieved. In the present paper, the elementary interaction mechanisms, from the entrance of dislocations in grain boundaries to the relaxation of the resulting intergranular stresses, are briefly reviewed. They are examined for two types of deformation tests and two types of materials: low temperature deformation and relaxation in copper and creep behaviour of alumina. Only the comparison between the response at different scales (nanoscopic, microscopic and mesoscopic) allows us to analyse the response of grain boundaries to an applied stress and to propose an interpretation of their role in macroscopic behaviour. This work may be considered as a preliminary step towards "Interface Engineering".